Officially preheated ROG 6 Dimensity Extreme Edition cooling system: you can directly "open the cover" for cooling-scripttoolbox.com

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Officially preheated ROG 6 Dimensity Extreme Edition cooling system: you can directly "open the cover" for cooling

time：2023-04-02 10:07:07 source：scripttoolbox.com author：Chassis

Officially preheated ROG 6 Dimensity Extreme Edition cooling system: you can directly "open the cover" for cooling

Not long ago, @ROG Gaming Phone officially announced that the ROG6 Dimensity Extreme Edition equipped with the MediaTek Dimensity 9000+ flagship platform will be released on September 19. Officials said that the new phone will have the strongest Android performance and bring a supreme gaming experience. The official also revealed that the comprehensive score of AnTuTu of the ROG6 Dimensity Extreme Edition exceeded 1.14 million points. It is reported that the Dimensity 9000+ adopts TSMC’s 4nm process and Armv9 architecture. The octa-core CPU includes one Arm Cortex-X2 super core with a main frequency of 3.2GHz, three Arm Cortex-A710 large cores and four Arm Cortex-A510 energy efficiency cores. According to the official introduction, the CPU architecture of Dimensity 9000+ and the flagship ten-core GPU of Arm Mali-G710 have improved by 5% compared with the previous generation CPU and 10% of GPU performance. As a dedicated gaming phone, in addition to the performance of the processor, heat dissipation has always been the focus of attention. A few days ago, the official released a video showing the cooling system of the ROG6 Dimensity Extreme Edition. It can be seen from the video that the ROG 6 Dimensity Extreme Edition will be equipped with a mechanical part that can be opened directly. After opening, the internal heat dissipation fins can be exposed, which can achieve faster and more direct heat dissipation. Combining with the appearance pictures of the ROG 6 Dimensity Extreme Edition previously exposed, the part is located in the middle part of the back of the phone body, and the area is not very large. For reference, the previously released ROG gaming phone 6 series uses a matrix liquid cooling architecture 6.0, equipped with an alloy vacuum chamber temperature plate and double-sided heat dissipation. Previously, ASUS has already had two 5G mobile phones that have passed 3C certification, the models are ASUS_AI2203_A and ASUS_AI2203_B. Both mobile phones are equipped with 65W chargers, which are expected to be the ROG 6 Dimensity series. In addition, according to today's revelations by digital blogger @Digital Chat Station, the ROG6 Dimensity Extreme Edition will be equipped with a 6.78-inch ultra-high brush rigid straight screen, equipped with IMX766 outsole main camera, built-in 6000mAh dual battery, support 65W fast charging, the new The heat dissipation scheme is very strong, and the AnTuTu running score is likely to exceed that of Qualcomm mobile phones. It is reported that the Red Devils 7S gaming phone has the strongest running score in the AnTuTu Qualcomm mobile phone camp in August, with a running score of over 1.12 million. As the first gaming phone equipped with the Dimensity 9000+ processor, the actual performance of the ROG6 Dimensity Extreme Edition is worth looking forward to.

(Responsible editor：Graphics card)

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