Huawei Mate 50 Pro dismantling: 90% domestic accessories PCB reserved chip position

time:2023-01-27 20:58:17 source:scripttoolbox.com author:Monitor
Huawei Mate 50 Pro dismantling: 90% domestic accessories PCB reserved chip position

Huawei Mate 50 is on sale. At present, many bloggers have begun to test real phones. Some people have even disassembled Huawei Mate 50 and Mate 50 Pro mobile phones. The interior has undergone a new design, from the layout and the use of accessories. Look, 90% of the components are domestic components. Starting from the back of the Mate 50 Pro, the back panel can be opened after heating. Compared with the Mate 40 Pro, it can be found that the camera position has been rearranged. Left: Mate 40 Pro Right: Mate 50 Pro Huawei Mate 50 is disassembled to see that the motherboard adopts a double-layer design. All components and chips are covered by a metal cover. After removing the shield, you can see the Snapdragon 8+ chips and memory chips. The double-layer design of the motherboard shows that the position of the 5G RF chip is reserved on the PCB of the Mate 50 Pro motherboard, and the filter capacitor resistance is not released. (8024646)

(Responsible editor:CPU)

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